announcing the  BOND SCHOLARSHIP FUND!  


Each Diamond sponsors: TULA Baby, ErgoBaby, Moby, and the BCIA has dedicated a portion of their sponsorship to scholarship. A private benefactor from Queens has agreed to MATCH these funds and we can now offer partial scholarships to those professionals who actively work across the prenatal and early postnatal time period!

The BOND Conference is committed to supporting the growth and professional development of those whose professions bring them into the earliest contact with infants and their families. The goal of the BOND Conference is to host a dialogue between researchers and practitioners, in order to enhance the practice of those committed to early infant health and family bonding

The BOND Conference is designed for you: 

  • Pediatricians
  • OB-GYNs
  • Neonatologists
  • Pediatric respiratory therapists
  • IBCLCs, or CLCs
  • Chiropractors
  • Birth or postpartum doulas
  • Midwives or midwifery students
  • Social workers or home health visitors
  • WIC counselors
  • Perinatal professionals
  • Nurse or a nursing students
  • Mental health professionals

We feel strongly about sharing the most recent research of our dedicated and highly recognized academic speakers with you. The BOND Conference is committed to providing a platform for you to learn, explore, and grow as practitioners, through the knowledge gained from our speakers and your discussions with others about what you have learned.

If you are in need of a partial scholarship to attend our event, we urge you to apply ASAP. Our current price for the full event is $597. In the application below, let us know something about yourself, why you feel a BOND Conference partial scholarship would benefit your education or practice, and let us know what you can afford to pay.

YOUR PARTICIPATION MEANS MORE TO US THAN YOUR MONEY.

All applications will be given serious consideration. The Scholarship committee will let you know within 72 hours if your scholarship is approved. You will then receive a link and a discount code to register for the conference.


Name *
Name
Address *
Address
The three day admission ticket to Bond Conference includes the conference binder/bag. (Does not include lunch.) You will hear within 72 hour if your partial scholarship request was approved and we will provide you a customized link and discount code for you to register
Please choose *
I understand this is a partial scholarship subsidized by our diamond sponsors. You are responsible for transportation to and from the conference and all cost associated with that.